Macrofab Engineering Podcast

Podcast Notes This week Stephen and Parker have a guest. Greg Sheridan of Octavo Systems. Greg is the Marketing and Sales Manager for Octavo Systems. Octavo Systems builds "System-in-Package" or SiP style chips to reduce the complexity of board layout and offset the costs more PCB layers. Their first product is a Beagle Bone on Chip IC called the OSD3358. Greg can rattle off the part number no problem as he was the one that came up with the naming convention. OSD3358-512M-BAS. Octavo Systems takes the die of the IC they want to integrate and combine it with the DRAM, decoupling, and power regulation needed and put them on a custom substrate. The IC die is then bond wired to the substrate. Octavo Systems gets their dies direct from the manufactures like Texas Instruments. The OSD3358-512M-BAS can be purchased at Digi-key in singles for almost $50. The BGA is a large pitch of 1.27mm. Octavo hopes it will help out the maker group. Uses normal IC packaging technology so it should be fairly robust. Thermal perfo